Die Lapping For Better CPU Performance

CPUs generate their heat in the silicon die that does all those wonderful calculations which make our computers work. But silicon conducts heat fairly poorly, so the thinner your CPU die, the better it will conduct heat out to the heatsink. This theoretically promises better cooling and thus more scope for performance. Thus, it follows that some overclockers have taken to lapping down their CPU dies to try and make a performance gain.

It’s not a simple process, as the team at [Linus Tech Tips] found out. First, the CPU must be decapped, which on the Intel chip in question requires heating to release the intermediate heat spreader. A special jig is also required to do the job accurately. Once the bare CPU is cleaned of all residual glue and heat compounds, it can then be delicately lapped with a second jig designed to avoid over-sanding the CPU.

After much delicate disassembly, lapping, and reassembly, the CPU appears to drop 3-4 degrees C in benchmarks. In overclocking terms, that’s not a whole lot. While the process is risky and complicated for little gain, the underlying premise has merit – Intel thinned things out in later chips to make minor gains themselves. Video after the break.

from Blog – Hackaday https://ift.tt/3fNWm84